Xinyuan New Materials Shines at Productronica China, Deepening Semiconductor Packaging Materials to Empower Industrial Upgrading

productronica China with its core products including sintered copper electrodes, copper-tin composite solders, pressureless sintered silver paste, and silver adhesive. The company precisely connected with global partners, demonstrating the strength of domestic packaging materials.

At present, semiconductor packaging materials are entering a critical window for domestic substitution and high-performance upgrading. Benefiting from Xinyuan New Materials' technological breakthroughs and market achievements in pressure-assisted sintering technology, the company will focus on promoting pressureless sintering solutions and products in the next stage.

With advantages of low-temperature sintering, high thermal conductivity, high reliability and high operability, Xinyuan's pressureless sintering products are perfectly suitable for high-end applications such as LEDs, radio frequency base stations and power amplifiers (PAs), solving pain points of traditional processes.

In the future, Xinyuan New Materials will focus on technological R&D, market expansion and ecological cooperation, optimize product performance, expand domestic and overseas markets, promote the large-scale application of semiconductor pressureless sintered silver paste and silver adhesive, help domestic semiconductor materials achieve breakthroughs and upgrading, and join hands with partners to empower the high-quality development of the semiconductor industry.