The R&D Center consists of more than 30 R&D engineers, including 6 Doctors and several Masters. 33% of the team holds postgraduate degrees (PhD, Postdoc, or Master’s). With a laboratory covering an area of over 518㎡.

The R&D Center is led by Yang Fan, a postdoctoral fellow in the field of electronic packaging materials . Relying on more than 10 years of in-depth work in the industry, he has successfully led the team to solve the technical problems of customers in the industry.

Focusing on breakthroughs in cutting-edge technologies and solutions to customers' pain points, the R&D Center has jointly established a "joint laboratory" with Harbin Institute of Technology to jointly cultivate professionals in materials science. The center boasts a technological achievement conversion rate exceeding 90%, reflecting its strong innovation-to-application capabilities.