A wonderful review of PCIM Europe 2025.

Shenzhen Xinyuan New Materials Co., Ltd. once again made an appearance at PCIM Europe 2025 with heat dissipation material solutions for HPD packaging, single-sided plastic packaging 3-in-1 packaging, and embedded packaging. Many of its products, such as nano-copper composite solders, system-level sintered copper pastes, and chip-level sintered silver pastes, attracted in-depth attention from well-known overseas first-tier brands like Dynex, ROHM, and Mitsui Metals. And it continued to reach cooperation on various product services with enterprises like Infineon, Onsemi, and Valeo. The materials promoted by Xinyuan New Materials have provided highly reliable material application solutions for industries such as new energy vehicles, radio frequency base stations, aerospace, and electronic communications.

During the three-day PCIM, the emerging embedded module material solutions became the top concern among global engineers.

Our company's PA-200C03 copper film used in Die-Attach has the advantages of excellent thermal conductivity and low price. The PA-700C series wet-laying sintered copper paste can achieve reliable interconnection between chips and substrates under the conditions of 250 °C and 20 MPa. It is compatible with the production process and equipment of the previous generation of sintered silver. Compared with silver paste, it has excellent mechanical properties and cost advantages and is an ideal solution for high-power module packaging.

The PA-800A series chip-level sintered alloy spacers have realized the clip interconnection on the front side of the chip with their shear strength of ≥60 MPa. They possess characteristics such as high current density, good heat uniformity, excellent thermal conductivity, and no residue after soldering.

Continuous innovation in packaging forms is the fundamental driving force for our company's unremitting pursuit. In the future, Xinyuan New Materials will continue to focus deeply on module packaging application solutions and effectively solve packaging reliability problems for global customers.

In addition, at the exhibition, some sintered copper electrode connection solutions actually applied by customers were also exhibited, and in-depth communication was carried out with overseas customers about this product used for chip front-side interconnection.

The sintered copper electrodes of the PA-300A03 and PA-300A01 series are compatible with the ultrasonic wire bonding process of copper wires with a diameter of 300 - 400 μm. They have good mechanical properties, electrical conductivity, and reliability, can help customers achieve higher current density and longer service life, and can meet the packaging application requirements of SiC modules and IGBT modules.

As a leading enterprise in the global thermal interface materials industry, we have become the preferred partner in the field of new energy electric vehicles with a market share of over 90% for DTC sintered copper electrodes. Relying on the advantages of large-scale intelligent manufacturing, we have achieved a monthly production capacity of several million pieces and can meet the supporting needs of 5,000 new energy vehicles in a single day. With a 99% on-time order delivery rate, we continue to provide reliable guarantees for mainstream domestic automobile enterprises and constantly refresh the industry service standards.

Xinyuan New Materials looks forward to meeting you at PCIM Asia Shanghai 2025 and even more anticipates revisiting and sharing the charm of packaging material applications with you at PCIM in Nuremberg in 2026.

Shenzhen Xinyuan New Materials Co., Ltd. is a technology enterprise with high-thermal-conductivity packaging interconnection materials as its core. It focuses on the research and development, production, sales, and technical services of heat dissipation packaging materials for semiconductors represented by nano-metal products, providing high-heat-dissipation and highly reliable solutions for power semiconductor packaging and advanced integrated circuit packaging.