On May 27, 2025, Hu Bo, the chairman of Shenzhen Xinyuan New Materials Co., Ltd. (hereinafter referred to as "Xinyuan New Materials"), was invited to participate in the "2025 Material Supply Partners Quality, Integrity and Anti-corruption Conference" held by Huawei in Songshan Lake.

Shenzhen Xinyuan New Materials Co., Ltd. once again made an appearance at PCIM Europe 2025 with heat dissipation material solutions for HPD packaging, single-sided plastic packaging 3-in-1 packaging, and embedded packaging. Many of its products, such as nano-copper composite solders, system-level sintered copper pastes, and chip-level sintered silver pastes, attracted in-depth attention from well-known overseas first-tier brands like Dynex, ROHM, and Mitsui Metals. And it continued to reach cooperation on various product services with enterprises like Infineon, Onsemi, and Valeo. The materials promoted by Xinyuan New Materials have provided highly reliable material application solutions for industries such as new energy vehicles, radio frequency base stations, aerospace, and electronic communications.

In May 2025, Shenzhen Xinyuan New Materials Co., Ltd. (hereinafter referred to as "Xinyuan New Materials") completed its Series C financing, with an exclusive investment from Beijing Xiaomi Zhizao Equity Investment Fund Partnership (Limited Partnership). This round of capital increase will mainly be used for the intensive research and development and industrial layout of silicon carbide module packaging materials, marking that Xinyuan New Materials has entered a new stage in the field of third-generation semiconductor electronic interconnection materials.