Continuously Leading the Track of Automotive-Grade Sintered Silver/Copper
In May 2025, Shenzhen Xinyuan New Materials Co., Ltd. (hereinafter referred to as "Xinyuan New Materials") completed its Series C financing, with an exclusive investment from Beijing Xiaomi Zhizao Equity Investment Fund Partnership (Limited Partnership). This round of capital increase will mainly be used for the intensive research and development and industrial layout of silicon carbide module packaging materials, marking that Xinyuan New Materials has entered a new stage in the field of third-generation semiconductor electronic interconnection materials.
Abandoning Domestic Substitution and Defining Globally Leading Solutions: Products Covering Top Automobile Manufacturers
Since its establishment, Xinyuan New Materials has always adhered to the concept of being brave in innovation and daring to be the first. It has given up the shortcut of low-price competition and domestic substitution, and instead chosen the difficult path of continuous investment and jointly defining product solutions with customers. The DTC solution jointly defined by Xinyuan New Materials and domestic top automobile manufacturers achieved the world's first large-batch vehicle installation, and currently still has a super high market share, far ahead of foreign products. Meanwhile, the low-pressure sintered silver paste developed by the company can be compatible with the bare copper AMB interface, reducing costs while improving the overall yield rate of customers' products. With years of refinement of products, Xinyuan New Materials has become the only enterprise in China that has realized the mass production and vehicle installation of automotive-grade sintered materials. Its product matrix has been deeply embedded in various top automobile manufacturers, with more than 5,000 vehicles equipped with its products every day, firmly ranking as the industry leader.
Technological Breakthrough:Sintered Copper and Nano-Copper Composite Solder Technology Reshaping the Packaging Pattern of High-Power Modules
Based on the sintered silver technology, Xinyuan New Materials has developed a new generation of sintered copper materials. By optimizing the mechanical properties and cost structure, this material has solved the cost problem in the packaging of high-power modules and become a substitute solution for sintered silver in silicon carbide module packaging. It is expected to achieve large-scale mass production in 2026. However, high sintering pressure remains a bottleneck restricting the popularization of sintered copper technology. To solve the problem of high sintering pressure, the nano-copper composite solder proposed by Xinyuan New Materials for the first time in the world has achieved an innovation in the system-level welding process. With a lower sintering pressure than that of sintered copper, it provides a better technological route for the interconnection of electric drive systems in electric vehicles. This technological breakthrough has further consolidated Xinyuan New Materials' leading position in the field of electronic interconnection materials for SiC modules.
Financial and Market Performance: A Fourfold Increase in Revenue
In the first quarter of 2025, the financial data of Xinyuan New Materials increased by 300% month-on-month. This growth benefited from the super high market share and the rapid development of the downstream new energy vehicle market. The company's expanded 6,000-square-meter production line will be officially put into use in July this year. By then, the production capacities of DTC, sintered silver paste, and sintered copper paste will be increased to support the vehicle installation of 20,000 vehicles per day to meet the order demands of customers.
Future Strategy: Deepening Technological Innovation and Promoting Chinese Technology to the Global Stage
From BYD's Series B financing in 2024 to Xiaomi's support in the Series C financing in 2025, Xinyuan New Materials, relying on its advanced technology, high-quality products, and broad market prospects, is steadily moving towards the IPO.
Taking technology as the engine, Xinyuan New Materials continues to lead the innovation wave of domestic electronic interconnection materials. In the future, it will focus on the iterative development of third-generation semiconductor packaging materials and is committed to promoting China's original interconnection material technology to the global market and jointly defining the next-generation electronic interconnection standards with partners.
PA-100A03B Chip-level Sinter Silver PasteA silver paste capable of achieving low-temperature chip-level interconnections, with a sintering temperature as low as 230°C. Compared to traditional solders, this product offers a 5x improvement in thermal conductivity and extends service life by more than 10 times. Utilizing a printing process, it is suitable for connections between power chips and substrates, ensuring higher thermal conductivity and reliability in applications.
PA-100A02 Chip-level Sinter Silver PasteA silver paste capable of achieving low-temperature chip-level interconnections, with a sintering temperature as low as 230°C. Compared to traditional solders, this product offers a 5x improvement in thermal conductivity and extends service life by more than 10 times. Utilizing a printing process, it is suitable for connections between power chips and substrates, ensuring higher thermal conductivity and reliability in applications.
PA-400A05 System-level Sinter Silver PasteA silver paste capable of achieving low-temperature system-level interconnections, with a sintering temperature as low as 200°C. Unlike chip-level pressure-assisted silver pastes, this system-level sintering silver paste enables large-area (≥2000 mm²) module packaging, offering significantly superior thermal performance and mechanical reliability compared to traditional solders.
PA-400A02A System-level Sinter Silver PasteA silver paste capable of achieving low-temperature system-level interconnections, with a sintering temperature as low as 200°C. Unlike chip-level pressure-assisted silver pastes, this system-level sintering silver paste enables large-area (≥2000 mm²) module packaging, offering significantly superior thermal performance and mechanical reliability compared to traditional solders.
PA-300A01-50NP Sinter Copper ElectrodeAn electrode sheet capable of achieving top-side interconnections for chips, compatible with copper wire ultrasonic bonding for wire diameters of 300-400 μm. Compared to aluminum wire, copper wire offers superior mechanical properties, electrical conductivity, and reliability, enabling higher current density and longer service life. This solution is suitable for SiC module and IGBT module packaging applications.
PA-300A03-507B Sinter Copper ElectrodeAn electrode sheet capable of achieving top-side interconnections for chips, compatible with copper wire ultrasonic bonding for wire diameters of 300-400 μm. Compared to aluminum wire, copper wire offers superior mechanical properties, electrical conductivity, and reliability, enabling higher current density and longer service life. This solution is suitable for SiC module and IGBT module packaging applications.
PA-600C01A System-level Sinter Copper PasteAn innovatively developed pressure-assisted sinter copper paste material, designed for reliable interconnections between chip/substrate and substrate/heat sink. It is compatible with the production processes and equipment used for sinter silver, while offering superior mechanical performance and cost advantages compared to silver paste. This makes it an ideal solution for high-power module packaging.
PA-700C01A Chip-level Sinter Copper PasteAn innovatively developed pressure-assisted sinter copper paste material, designed for reliable interconnections between chip/substrate and substrate/heat sink. It is compatible with the production processes and equipment used for sinter silver, while offering superior mechanical performance and cost advantages compared to silver paste. This makes it an ideal solution for high-power module packaging.
PA-500C03A1 Nano Copper Composite Solder （TLPS）A solder capable of achieving low-temperature, low-pressure interconnections, with a soldering temperature as low as 230°C. It is suitable for both large-area chip-level soldering and system-level module soldering, offering excellent mechanical strength and reliability.
PF-01A80 Pressureless Sinter Silver PasteHigh Thermal Conductivity Pressureless Sintered Conductive Silver Paste. Thermal conductivity up to 270 W/m·K, curing temperature 200℃.With exhibits stable and high bond strength on gold/silver interfaces.
PF-02A795A Pressureless Sinter Silver PasteMedium to High Thermal Conductivity Pressureless Sintered Conductive Silver Paste with curing temperature 200℃. Outstanding continuous workability, wide process window, excellent thermal conductivity and reliability.
PF-01B89SF6B Pressureless Semi-Sinter Silver AdhesiveMedium to High Thermal Conductivity Pressureless Semi-Sintered Conductive Adhesive. Enables interconnection of high stress mismatch structures and long-term service reliability.
PF-01B91D Pressureless Sinter Silver AdhesiveMedium to High Thermal Conductivity Pressureless Semi-Sintered Conductive Adhesive with stable high bond strength on gold/silver interfaces. Particularly suitable for high-power and large-size LED packaging.
PF-01B91C High Thermal Conductivity Conductive AdhesiveHigh Thermal Conductivity Conductive Adhesive with high thermal conductivity, long working time, 260℃ heat resistance. Suitable for medium to small power, high-reliability LED products.
PF-03B85 High Temperature Resistance Conductive AdhesiveHigh Temperature Resistance Conductive Adhesive with strong dispensing stability, long working time, 260℃ heat resistance. Suitable for small-power LED products.
