Entering Hall N5, the booth of Xinyuan New Materials, with its design that combined innovation and practicality, built a bridge for dialogue with global industry partners. In front of the E68 booth, there was a constant stream of people. Professional visitors and partners from all over the world stopped to take a look. From automotive-grade silver paste to sintered silver adhesive, from nano-copper composite solder to sintered copper materials, each product carried Xinyuan New Materials' persistent pursuit of technological innovation, attracting visitors to explore further.
During the forum session of the exhibition, Dr. Yang Fan, our company's R & D director, shared with the whole audience the core technology of "Nano-copper composite solder helps power modules achieve low-temperature and highly reliable connections". Dr. Yang Fan gave an in-depth explanation from the technical evolution of transient liquid phase diffusion welding to the development and application of Xinyuan New Materials' products. This was not only a professional forum speech but also a declaration by Xinyuan New Materials, as a leader in the thermal interface materials industry, to convey China's new materials technology concepts to the world.
Taking this exhibition as a new starting point, Xinyuan New Materials will continue to increase investment in research and development, continuously improve service quality and technological level, adhere to the values of being customer-centered and self-driven, and be committed to providing customers with higher-quality and more efficient new materials solutions. We will closely follow the development trends of the industry, continuously expand application areas, strengthen cooperation and exchanges with domestic and foreign enterprises, jointly promote the innovative development of the power electronics industry, and contribute more to achieving high-quality development of the industry!