Xinyuan New Materials Concludes a Successful PCIM Asia Shenzhen 2026

From August 26 to 28, 2026, PCIM Asia — the Shenzhen International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management — was held at the Shenzhen World Exhibition & Convention Center (Bao'an). Shenzhen Xinyuan New Materials Co., Ltd. exhibited its portfolio of high-thermal-conductivity packaging interconnect materials and thermal management solutions.

The products on display covered silver sintering materials, copper sintering materials, and embedded packaging thermal management solutions, applicable to a wide range of scenarios including SiC/GaN power modules, IGBTs, and automotive-grade chip packaging. The booth featured a product sample display area and a technical exchange area. Supported by physical samples, performance parameters, and real-world application data, the technical team explained to visiting attendees the process conditions, applicable scenarios, and implementation pathways of each product, and provided tailored responses to specific packaging requirements raised by visitors.

Over the three-day exhibition, the booth welcomed professional visitors from across the industry chain, including power semiconductor device manufacturers, module packaging companies, new energy vehicle OEMs and component suppliers, photovoltaic and energy storage enterprises, as well as universities and research institutes. Visitors engaged in face-to-face discussions with the on-site technical team on industry-wide topics such as packaging thermal management, low-temperature sintering processes, and the domestic substitution of packaging materials.

Xinyuan New Materials has long been focused on the R&D and production of packaging thermal management materials, equipped with clean production workshops and a reliability laboratory. This exhibition provided a direct channel for the Company to connect with industry chain demands and stay abreast of technological trends. Going forward, the Company will continue to advance the technology R&D and product optimization of relevant materials, and deliver corresponding products and technical services to the market.