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About XINYUANProviding high-heat-dissipation and highly reliable solutions for power semiconductor packaging and advanced integrated circuit packaging.About XINYUAN Development Timeline Qualifications & Honors Offices and Contact Information Contact Us
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Products & Applications
Pressure Sinter Silver Paste Sinter Copper Electrode Silver Film Pressure Sinter Copper Paste Alloy Spacer Cu-Sn composite paste Pressureless Sinter Silver Paste Pressureless Sinter Silver Adhesive Preform
PA-100A06A Chip-level Sinter Silver PasteA silver paste capable of achieving low-temperature chip-level interconnections, with a sintering temperature as low as 230°C. Compared to traditional solders, this product offers a 5x improvement in thermal conductivity and extends service life by more than 10 times. Utilizing a printing process, it is suitable for connections between chips and substrates, ensuring higher thermal conductivity and reliability in applications.
PA-100A01 Chip-level Sinter Silver PasteA silver paste capable of achieving low-temperature chip-level interconnections, with a sintering temperature as low as 230°C. Compared to traditional solders, this product offers a 5x improvement in thermal conductivity and extends service life by more than 10 times. Utilizing a printing process, it is suitable for connections between chips and substrates, ensuring higher thermal conductivity and reliability in applications.
PA-100A02 Chip-level Sinter Silver PasteA silver paste capable of achieving low-temperature chip-level interconnections, with a sintering temperature as low as 230°C. Compared to traditional solders, this product offers a 5x improvement in thermal conductivity and extends service life by more than 10 times. Utilizing a printing process, it is suitable for connections between power chips and substrates, ensuring higher thermal conductivity and reliability in applications.
PA-400A05 System-level Sinter Silver PasteA silver paste capable of achieving low-temperature system-level interconnections, with a sintering temperature as low as 200°C. Unlike chip-level pressure-assisted silver pastes, this system-level sintering silver paste enables large-area (≥2000 mm²) module packaging, offering significantly superior thermal performance and mechanical reliability compared to traditional solders.
PA-400A02A System-level Sinter Silver PasteA silver paste capable of achieving low-temperature system-level interconnections, with a sintering temperature as low as 200°C. Unlike chip-level pressure-assisted silver pastes, this system-level sintering silver paste enables large-area (≥2000 mm²) module packaging, offering significantly superior thermal performance and mechanical reliability compared to traditional solders.
PA-300A03-509A Sinter Copper ElectrodeAn electrode sheet capable of achieving top-side interconnections for chips, compatible with copper wire ultrasonic bonding for wire diameters of 300-400 μm. Compared to aluminum wire, copper wire offers superior mechanical properties, electrical conductivity, and reliability, enabling higher current density and longer service life. This solution is suitable for SiC module and IGBT module packaging applications.
PA-300A01-50P Sinter Copper ElectrodeAn electrode sheet capable of achieving top-side interconnections for chips, compatible with copper wire ultrasonic bonding for wire diameters of 300-400 μm. Compared to aluminum wire, copper wire offers superior mechanical properties, electrical conductivity, and reliability, enabling higher current density and longer service life. This solution is suitable for SiC module and IGBT module packaging applications.
PA-300A03-507A Sinter Copper ElectrodeAn electrode sheet capable of achieving top-side interconnections for chips, compatible with copper wire ultrasonic bonding for wire diameters of 300-400 μm. Compared to aluminum wire, copper wire offers superior mechanical properties, electrical conductivity, and reliability, enabling higher current density and longer service life. This solution is suitable for SiC module and IGBT module packaging applications.
PA-600C01A System-level Sinter Copper PasteAn innovatively developed pressure-assisted sinter copper paste material, designed for reliable interconnections between chip/substrate and substrate/heat sink. It is compatible with the production processes and equipment used for sinter silver, while offering superior mechanical performance and cost advantages compared to silver paste. This makes it an ideal solution for high-power module packaging.
PA-700C01A Chip-level Sinter Copper PasteAn innovatively developed pressure-assisted sinter copper paste material, designed for reliable interconnections between chip/substrate and substrate/heat sink. It is compatible with the production processes and equipment used for sinter silver, while offering superior mechanical performance and cost advantages compared to silver paste. This makes it an ideal solution for high-power module packaging.
PA-500C03C Nano Copper Composite Solder （TLPS）A solder capable of achieving low-temperature, low-pressure interconnections, with a sintering temperature as low as 230°C. It is suitable for both large-area chip-level sintering and system-level module sintering, offering excellent mechanical strength and reliability.
PA-500C03A1 Nano Copper Composite Solder （TLPS）A solder capable of achieving low-temperature, low-pressure interconnections, with a soldering temperature as low as 230°C. It is suitable for both large-area chip-level soldering and system-level module soldering, offering excellent mechanical strength and reliability.
PF-01A90B Pressureless Sinter Silver PasteFully sintered conductive silver paste. It features excellent processability, large-area sintering performance and high reliability.
PF-02A795A3 Pressureless Sinter Silver PasteFully sintered conductive silver paste, suitable for power amplifiers (PA) in high-density packaging communication terminals. It features excellent dispensing stability and long working life, providing a high-performance interconnection solution between GaAs chips and substrates.
PF-01A90A Pressureless Sinter Silver PasteHigh Thermal Conductivity Pressureless Sintered Conductive Silver Paste. Thermal conductivity up to 270 W/m·K, curing temperature 200℃.With exhibits stable and high bond strength on gold/silver interfaces.
PF-02A795A Pressureless Sinter Silver PasteMedium to High Thermal Conductivity Pressureless Sintered Conductive Silver Paste with curing temperature 200℃. Outstanding continuous workability, wide process window, excellent thermal conductivity and reliability.
PF-02B800A1 Medium thermal conductivity silver adhesiveMedium thermal conductivity silver adhesive enables highly reliable sintering bonding in air or N₂ atmosphere. It features low RBO, relatively high thermal conductivity and excellent interfacial reliability, providing a non-pressure interconnection solution for chip interconnection on bare copper and bare silicon surfaces.
PF-01B92A Medium‑high thermal conductivity semi‑sintered silver adhesiveMedium-high thermal conductivity semi-sintered silver adhesive enables highly reliable sintering bonding in air or N₂ atmosphere. It features low RBO, high thermal conductivity and excellent interfacial reliability, providing a non-pressure interconnection solution for bare copper or gold/silver-plated substrates and chips with copper/gold/silver-plated surfaces.
PF-03B85B1 Medium‑low thermal conductivity silver adhesiveMedium-low thermal conductivity silver adhesive, featuring high thermal conductivity, long working life and excellent heat resistance. Suitable for medium-low power, high-reliability LED products.
PF-01B91DA1 Medium‑high thermal conductivity semi‑sintered silver adhesiveMedium-high thermal conductivity non-pressure semi-sintered conductive adhesive, featuring stable and high bonding strength on gold and silver surfaces. Particularly suitable for high-power, large-size LED packaging.
PF-01B89SF6B Pressureless Semi-Sinter Silver AdhesiveMedium to High Thermal Conductivity Pressureless Semi-Sintered Conductive Adhesive. Enables interconnection of high stress mismatch structures and long-term service reliability.
PF-01B91D Pressureless Sinter Silver AdhesiveMedium to High Thermal Conductivity Pressureless Semi-Sintered Conductive Adhesive with stable high bond strength on gold/silver interfaces. Particularly suitable for high-power and large-size LED packaging.
PA-800C01 Chip-level Sinter Copper PreformCustomizable dimensions, no residual edges, high pre-fix bonding strength, suitable for embedded packaging. Features an original sandwich laminate structure with excellent reliability, satisfying performance requirements for high-mismatch embedded structures.
PA-800A03 Chip-level Sinter Silver PreformCustomizable dimensions, no residual edges, high pre-fix bonding strength, suitable for embedded packaging. Features an original sandwich laminate structure with excellent reliability, satisfying performance requirements for high-mismatch embedded structures. -
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About XINYUANProviding high-heat-dissipation and highly reliable solutions for power semiconductor packaging and advanced integrated circuit packaging.
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