Electronic Communication

Xinyuan New Materials' communication-grade sintered silver products and highly thermally conductive silver adhesive materials have achieved key breakthroughs in the field of radio frequency communication. The sintered silver materials can meet the high heat dissipation requirements of devices such as power amplifiers in 5G base stations, with a thermal conductivity of over 100W/mK, and at the same time support the stability under high-frequency signal transmission.

For example, in optical communication modules, Xinyuan's thermally conductive silver adhesive for photoelectric packaging can quickly dissipate the heat of laser chips, ensuring the long-term reliability of the devices under high-speed modulation. Xinyuan New Materials has also cooperated with domestic communication equipment manufacturers to provide packaging solutions for the core chips of 5G small base stations, helping the equipment achieve lightweight and low-power consumption designs.

In addition, Xinyuan's electromagnetic shielding materials can effectively suppress radio frequency interference and improve the anti-interference ability of communication equipment. They have been applied to products such as mobile phones and satellite communication terminals.