Radio Frequency Base Stations

In response to the challenges of high power density and heat dissipation in radio frequency base stations, the sintered silver paste provided by Xinyuan New Materials can enable double-sided sintering of the power modules in base stations, forming a highly thermally conductive connection layer (with a thermal conductivity of 240W/m·K) to quickly dissipate the heat of chips and ensure the stability of the base stations under long-term high-load operation.

Meanwhile, by optimizing the distribution of nano-metal particles, the materials can effectively shield the electromagnetic interference inside the base stations and improve the efficiency of signal transmission. They have already been applied to the radio frequency front-end modules of 5G base stations.

In addition, Xinyuan's nano-solder bonding materials support the high-precision interconnection of radio frequency chips in base stations and are compatible with the ultrasonic bonding of copper wires with a diameter of 300 - 400μm. Compared with traditional aluminum wire solutions, they can achieve higher current density and a longer service life.

With these technological advantages, Xinyuan's products have become the preferred material suppliers for mainstream base station equipment manufacturers in China.